• 1910: The first president, Genkichi Asami, founded the company in Minami Inari-cho, Shitaya-ku, Tokyo (now Higashi-Ueno, Taito-ku, Tokyo).

    1941: Due to wartime controls, businesses from all over the country joined forces to form the Japan Solder and Tin Manufacturing Association. The second president, Minosuke Asami, became the association's chairman.

    1944: Due to changes in the Enforcement Regulations of the Commerce and Industry Association Law, the association was dissolved, and Nihon Handa Industry Co., Ltd. was established.

    1952: The company began manufacturing RAPIDSOL (patented flux cored wire solder).

    1965: The company became a Defense Agency-certified factory for MIL-STD (United State Military Standard) solder and flux.

    1966: Became a factory authorized to display JIS standards for all types of solder and flux cored wire solder.

    1977: Constructed a new factory in Narashino, Funabashi City.

    Started mass production and sales of DG solder (vacuum degassed solder).

    1983: Constructed a second factory. Started manufacturing and selling solder paste.

    1989: Name changed to "Nihon Handa Co., Ltd."

    1993: Started manufacturing and selling conductive adhesive ‘DODENT’.

    1995: Received the "Tanabe Invention Achievement Award" at the 20th Invention Grand Prize for the development of vacuum degassed solder.

    Established joint venture Malaysian Fine Material Sdn. Bhd. in Penang, Malaysia.

    1996: Received the Director General of Science and Technology Agency Award Science for the development of vacuum degassing solder.

    ISO 9001: 1994 quality system registered.

    2002: Malaysian Fine Material Sdn. Bhd. became a wholly owned subsidiary and changed its name to Nihon Handa Manufacturing (Malaysia) Sdn. Bhd.

    Established Nihon Handa Manufacturing (Shanghai) Co., Ltd., a joint venture, in Shanghai, China.

    2004: ISO14001: Environmental management system registered.

    2005: Opened Hong Kong sales office.

    2007: Established Electronic Materials Research Laboratory at Anesaki-Kaigan, Ichihara City.

    2008: Received new JIS certification for solder.

    Started manufacturing and selling sintered bonding materials (MAX series).

    2010: Made Nihon Handa (Shanghai) Co., Ltd. a 100% subsidiary.

    100th anniversary of founding.

    2015: Established the Shenzhen branch of Nihon Handa (Shanghai) Co., Ltd.

    2018: Head office relocated.

    2019: Funabashi factory IATF16949 certified.

    2020: 110th anniversary of founding.

    2021: Established Nihon Handa (Hubei) Electronic Materials Co., Ltd.